ANNOUNCEMENT

NOBEL PRIZE 2026

This year's laureates, their fields, and the discoveries that earned them the prize.Live nowSee the winners
Moonbase
← Back to Awards
NSFDirectorate for Technology, Innovation, and Partnerships

PFI-TT: High-Performance Nanostructured Pads for Efficient Electronics Cooling

Completed
Institution
Carnegie Mellon University, PA
Principal investigator
Sheng Shen
Funding
$550K
Duration
2024–2026
Open portfolio

Moonbase score

Still being scored

Abstract

The broader impact of this Partnerships for Innovation - Technology Translation (PFI-TT) project is to provide an innovative solution to the heat dissipation challenge at the interfaces between electronics and cooling systems. With continually increasing power density, the performance of heat dissipation technologies has become a dominant limiting factor in maintaining the safe and stable operation of electronics. The technology being developed in this PFI project enables electronics to operate at lower temperatures, thereby enhancing their performance and reliability. Additionally, in data centers where cooling demands consume vast amounts of water and electricity, this technology can significantly improve thermal management and energy efficiency, contributing to industrial decarbonization and climate change mitigation. The team investigates scalable and cost-effective manufacturing strategies for mass producing high-performance, nanostructured, thermal pads and exploring their integration with existing products to realize their full commercialization potential. The high-performance, nanostructured, thermal pads developed in this project could resolve the critical challenge of heat dissipation by substantially reducing thermal interface resistance and enhancing system reliability. The high compliance and flexibility of the new nanostructured thermal pads enables absorption of thermal stresses due to the different coefficients of expansion of two mating materials. The materials will also accommodate dynamic structural stresses and vibrations, which will significantly improve device or system reliability. Scalable and cost-effective manufacturing technologies will be developed to accelerate the commercialization of the nanostructured thermal pads. Through the collaboration with the industry partner, the nanostructured thermal pads will undergo comprehensive validations to meet industrial needs for commercialization. This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria.

LOADING MOONBASE SCORE

Directorate for Technology, Innovation, and PartnershipsMaterials EngineeringPFI-Partnrships for Innovationcoolingthermalcommercializationnanostructuredelectronicspfi-tthigh-performancedissipation

Questions for Carnegie Mellon University

Answered by the team behind this research.

Same institution, same topic, scored first.