Travel: Student Travel Support for 2026 IEEE Radio & Wireless Week (RWW)

The IEEE Radio & Wireless Week (RWW) covers a broad range of emerging research topics in radio wireless technologies, from theory to practical implementation, from integrated chips to large-scale systems, from kilohertz (kHz) to terahertz (THz), and from communications to sensing and space applications. It is sponsored by the IEEE Microwave Theory and Technology Society, with technical co-sponsorships from the IEEE Antennas and Propagation Society, the IEEE Aerospace and Electronic Systems Society, and the IEEE Geoscience and Remote Sensing Society. The conference serves as a vital platform for unveiling cutting-edge research and emerging trends in wireless technologies, including 5G/6G, the Internet of Things (IoT), AI-driven networks, and healthcare applications. The 21st annual IEEE RWW will be held in Los Angeles, California on January 18-21, 2026. To support the training of the next-generation scientists and engineers working on 5G/6G Wireless, this NSF grant will provide travel support for 25 students to present their research papers at the conference and learn the cutting-edge research and development of wireless technologies, systems, and applications. The travel grants will be awarded competitively to undergraduate and graduate students from U.S. universities who will present their accepted papers at the conference. The awardees will be selected by a committee of the conference and the paper quality will be considered in the selection process. The travel support will benefit the participating students' career developments and contribute to the U.S. STEM workforce development. The IEEE RWW in 2026 consists of five co-located sub-conferences: Topical Conference on Power Amplifiers for Wireless and Radio Applications (PAWR), Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems (SiRF), Topical Conference on Wireless Sensors and Sensor Networks (WiSNet), Space Hardware and Radio Conference (SHaRC), and Radio and Wireless Symposium (RWS). In addition, the IEEE RWW in 2026 is co-located with the 2nd IEEE International Conference on Additively Manufactured Electronic Systems (AMES), creating a distinctive interdisciplinary environment that broadens the scope of learning and collaboration. Students attending the conference will learn about the latest state-of-the-art wireless technologies in these topical areas covering devices, integrated circuit (IC) chips, antennas, system architectures, and emerging applications such as 6G Wireless, AI-enhanced wireless network, biomedical sensing, and space communications/sensing. This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria.